Microjet EC, water only cleaning systems, Austin American Technology
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Austin American Technology's MicroJet™ EC breakthrough advances in cleaning technology bring Progressive Energy Dynamics to the MicroJet EC In-line Cleaning System resulting in cleaning power unequalled in its class. Developed using complex modeling techniques, this innovative approach to cleaning ensures that each progressive stage in the process optimizes mechanical, thermal and chemical energy to achieve the best possible performance. High-density assemblies can be effectively cleaned at line speeds in a footprint not much greater than a batch system.
Featuring a standardized Mach II+, powered by a 20Hp blower, the Austin American Technology MicroJet™ EC's drying capability meets increasing throughput demands as your requirements change - without adding to the size of the machine's footprint! Ideal for water-only cleaning, the MicroJet™ EC in-line system also offers easy accessibility and simple maintenance to maximize uptime and productivity.
Optimized impingement force and flow management give the MicroJet™ EC in-line cleaning system the power to out-perform other machines in its class in tough, water-only applications with low-standoff height components. Patented high-volume, directed flow drying technology complements the machine's outstanding cleaning capability by efficiently forcing water out of tight spaces and not allowing evaporation to leave behind harmful residues.
Fluid Flow Mechanics: Key to Low Standoff Cleaning (Download PDF | Download Presentation)
Development and Validation of a new Cleaning Test Platform  "Innovative electronic assembly designs strive to increase
functionality over smaller surface areas. Highly dense
circuit assembly designs increase the cleaning challenge.
Understanding the balance between static chemical and
mechanical driving forces is fundamental to predicting and
optimizing process variables."(Download PDF)
Cleaning under Flush Mounted Caps  "Removal of flux residue under highly dense chip caps
presents a difficult cleaning challenge. Chip caps are
flush mounted to the circuit card. Upon reflow, flux
residue fills the gap under the chip cap. Cleaning fluids
must wet, dissolve, penetrate the flux dam, and flow
under the component to adequately remove all flux residues. Increased board density, miniaturization, and
Pb-free soldering magnify this problem. To address
this problem, process parameters in the form of
cleaning temperature, time, cleaning chemistry
concentration, and impingement energy must be
considered. This paper presents the results from a
designed experiment of an advanced cleaning fluid
combined with an optimized inline spray-cleaning
machine for removing flux residue under flush mounted chip caps"(Download PDF)
Optimizing Cleaning Energy in Batch and Inline Spray Systems  "Removal of flux residue under highly dense chip caps
presents a difficult cleaning challenge. Chip caps are
flush mounted to the circuit card. Upon reflow, flux
residue fills the gap under the chip cap. Cleaning fluids
must wet, dissolve, penetrate the flux dam, and flow
under the component to adequately remove all flux residues. Increased board density, miniaturization, and
Pb-free soldering magnify this problem. To address
this problem, process parameters in the form of
cleaning temperature, time, cleaning chemistry
concentration, and impingement energy must be
considered. This paper presents the results from a
designed experiment of an advanced cleaning fluid
combined with an optimized inline spray-cleaning
machine for removing flux residue under flush mounted chip caps"(Download PDF) |
"In recent years, various studies have been issued on cleaning under low standoff components; most however, with incomplete information. It is essential to revisit and describe the latest challenges in the market, identifying obvious gaps in the available information. Such information is crucial for potential and existing users to fully address the cleanliness level under their respective components. With the emergence of lead free soldering and even smaller components, new challenges have arisen including gaps of less than 1-mil."